MATSE 461: Electronic Materials and Processing II, Non-semiconductor materials and processing

Textbook: James W. Mayer and S.S. Lau, Electronic Materials Science for Integrated Circuits in Si and GaAs, MacMillan and course notes.

References:

Shyam P. Murarka and Martin C. Peckerar, Electronic Materials Science and Technology, Academic Press, 1989.
Shyam P. Murarka, Silicides for VLSI Applications, Academic Press, 1983.
Ben G. Streetman, Solid State Electronic Devices (Prentice-Hall).
Keshra Sangwal, Etching of Crystals (North Holland).
S.M. Sze, VLSI Technology (McGraw-Hill).
R.A. Levy, Microelectronic Materials and Processes (Kluwer).
R.E. Hummel, Electronic Properties of Materials (Springer-Verlag).

Catalog Description, Prerequisites and Schedule:

Introduction to the materials science, engineering, and processing of microlithographic materials, conductors and dielectrics for electronic applications. The course makes use of the concepts developed in materials science to understand why certain materials make acceptable contacts and dielectrics while others do not. Demonstrates how manufacturing problems can be overcome with careful materials design and processing. Examines some of the processing techniques commonly used in microelectronic circuit manufacture during metallization, dielectric formation and lithography. Prerequisite: PHYS 214; MATH 385 or consent of instructor; MSE 304 or PHYS 460, ECE 440, or equivalent. Course credit: 3 hours. Contact hours: 3 lecture-discussion hours/week.

Course Topics:

1. Conductors for Integrated Circuits (simple metals, metal alloys, electromigration resistant materials, compounds, silicide nucleation and reaction kinetics, interface stability criteria, transparent conductors)
2. Sputter Deposition of Thin Films
3. Dielectrics for Integrated Circuits (Silicon dioxide, oxidation kinetics, process additives and how they influence properties, nitrides, plasma-enhanced deposition, high k materials, low k materials)
4. Chemical mechanical polishing
5. Rapid thermal processing
6. Introduction to lithography
7. Photoresists (single and multicomponent, dyes, contrast enhancers, photoactivated compounds, dissolution inhibitors)
8. Reactive Ion Etching

Course Objectives:

1. To provide an in-depth description of the materials science that underlies the non-semiconductor materials in microelectronic devices. (In particular, interfacial stabilities, process chemistries, and reaction kinetics)
2. To describe and provide a fundamental understanding of techniques for design and engineering of non-semiconductor materials for microelectronics.
3. To teach students methods for design of metals and dielectrics for nanoscale electronic applications
4. To teach students the two primary methods of processing materials in microelectronics (sputtering and reactive ion etching)
5. To illustrate the application of basic materials science to electronic materials design (alloy theory and phase diagrams, point and extended defects in materials and their thermodynamics, process kinetics, polymer science.)
6. To challenge students with open ended design questions integrating the course material with materials from previous classes.

Course Outcomes:

1. Given a hypothetical or real problem with an electronic materials device or process, explain the cause of the problem and propose solutions to the problem.
2. Prepare a high quality team-oriented project on a subject of relevance to electronic materials and processing. This project requires the team to make a recommendation to a "Vice President for Technology" at a hypothetical microelectronics company concerning a decision among current technology options. The team prepares the project together, is self-organized, presents a team overview of a poster orally and provides a team-written report on the recommendation.
3. Understand how materials interact at the nanoscale, what makes an interface stable, and how to design for stability.
4. Recommend processes or conditions for a given process for fabrication of semiconductors.
5. Given the performance of an electronic device, diagnose problems and predict the nature of the defects giving rise to these. Recommend methods for improvement.
6. Understand the design of advanced multicomponent photoresists.

Assessment Tools:

1. Homework problems involving open-ended questions and design problems.
2. Three closed book exams designed to test the student's ability to apply his/her knowledge.
3. A term project graded on effectiveness, content, organization, and English composition.
4. An oral summary of the team project poster and answers to questions from the class.
5. Team learning approach. The project teams are evaluated on their effectiveness as a team and their interactions.

Contribution of Course to Meeting the Professional Component

100%

Prepared by:

Angus Rockett, September 2006